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BITS&CHIPS HARDWARE CONFERENCE

13th June 2012

1931 Congrescentrum Brabanthallen, 's-Hertogenbosch

http://www.hardwareconference.nl/

During the Bits&Chips Hardware Conference in ‘s-Hertogenbosch, the Netherlands on Wednesday 13 June 2012, MSC will present the Lattice and Microsemi SoC programmable logic solutions.

The main topics of this event will be:

• High-performance electronics (FPGA design, high-speed boards)
• Smart lighting (including intelligent and low-power lighting)
• Design of low-power chips and electronics
• Smart batteries and power supplies (including automotive and power electronics) 

MSC will present  during the conference:

• Microsemi SoC – SmartFusion Motor Control Applications and Power Management Solutions
  The SmartFusion customizable system-on-chip (cSoC) is the only device that integrates an FPGA, ARM® Cortex™-M3, and programmable analog, offering full customization, IP protection and ease-of-use.
• Lattice – ECP3&ECP4 video solutions and Interfacing low-cost SERDES FPGA to x86 or ARM Cortex-Ax Q7 solutions

The LatticeECP3 family, is the third generation high value FPGA from Lattice Semiconductor, which offers the industry's lowest power consumption and price of any SERDES-capable FPGA device. The LatticeECP3 FPGA family offers multi-protocol 3.2G SERDES with XAUI jitter compliance, DDR3 memory interfaces, powerful DSP capabilities, high density on-chip memory and up to 149K LUTS, all with half the power consumption and half the price of competitive SERDES-capable FPGAs.  

The new LatticeECP4 family is the fourth generation of innovative, low cost, low power FPGAs with hard-wired Intellectual Property Communication Engines and powerful DSP Blocks. The innovative LatticeECP4 FPGA family is ideal for cost- and power-sensitive wireline, wireless, video, industrial, and computing applications. The new LatticeECP4 FPGA family offers versatile 6G SERDES for high speed data transmission, built-in MACO Communication Engines for efficient protocol processing, 7x more powerful DSP Blocks for wireless and video, 1066 Mbps DDR3 memory interfaces, high density on-chip memory and up to 250K logic elements (LUTs).

This event for high educated professionals and technical managers is aimed at information exchange, relationship building and networking.