Welcome to embedded world 2012!

Atmel ® AVR ® and AVR32 ® Xplained Evalkit Series

Ideal hardware platform for the new AVR Studio ® 5

MSC presents the new generation of universal Xplained Atmel development boards, which are pin-compatible with each other and are available in form factor 85 mm x 54 mm for the main AVR ® and AVR32 ® families are available. This simple idea allows the use of Atmel AVR and AVR32 MCUs in connection with its own hardware, connected via the IO connectors J1 to J4, or with Atmel's own sensor boards that are plugged into J1 and J2. Xplained are available for AVR ATMEGA1284, ATXMEGA128A1, ATXMEGA B1, ATXMEGA A3BU UC3L and AVR32, and soon UC3A3 UC3C. Further Xplained kits will follow shortly. Documented schematics pick lists and full support for the commissioning by many example projects and driver package from the free AVR Studio ® 5, will help quickly to realize ideas on these small hardware platforms. For each kXplained kit there are also corresponding "Getting Started" application notes.

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Atmel offers a variety of sensor boards with acceleration, magnetic and gyro instrument (gyroscope) and accurate pressure sensors. Using the AVR Studio ® 5 Software Framework (ASF) included drivers can easily calibrated data collected, visualized and used for your own applications: Here can be developed from the Xplained for example, a remote-controlled helicopter with integrated autopilot! Furthermore, there are Xplained system boards for Atmel's compatible digital LM75 temperature sensors and the crypto and authentication products. Other boards, including third-parties are in preparation. In Atmel's application note AVR4014 is described how to develop Xplained compatible expansion boards. For further information please contact MSC Vertriebs GmbH. Contact: micros-atmel@msc-ge.com

Five new Atmel 400MHz ARM926 Products With Full OS Support Available …

DDR2, 480 Mbit HS USB, dual Ethernet, dual CAN, TFT on-chip!

New Cortex-M0 Based Microcontrollers From Samsung Address Market for Cost-sensitive Motor and LCD Control Designs

High-performance and competitively-priced:

Stutensee (Germany), September 09, 2011 - MSC now offers four new cost-effective ARM Cortex-M0 based 32-bit microcontrollers (MCUs) from Samsung Semiconductor. These MCUs are ideally suited for industrial and building automation applications that are sensitive to price.

The S3FN429 MCU is provided in a 44-pin QFP package and has 32 KBytes of flash, 2 KBytes RAM, 3-phase motor controller, pulse position decoder, comparators, operational amplifier and 12-bit AD converters. This device is ideally suited for use in the control of BLDC motors.

The S3FN41F MCU is available to developers of more challenging motor controller designs. This device is provided in an 80-pin TQFP package and has 256 KBytes of flash and 32 KBytes RAM. In addition to peripheral blocks, which also exist on the S3FN429 MCU, the S3FN41F MCU offers six DMA channels, a 28x8 or 32x4 LCD controller as well as several additional interfaces such as UART, SPI, I2C, CAN and USB 2.0 function. Both the S3FN429 MCU and the S3FN41F MCU are clocked at 40 MHz, achieve a maximum computing power of up to 0.9 DMIPS/MHz and can operate with 3.3 V as well as 5 V supply voltage.

The S3FN21D MCU is clocked at 20 MHz and provided in a 176-pin LQFP package. This device has 128 KBytes of flash, 8 KBytes RAM, USB 2.0 function interface and an 80x32 LCD controller. Furthermore, power-saving standby functions and a real time clock (RTC) with calendar function are integrated on the device. This device is perfect for driving big customized LCDs.

The S3FN60D MCU is clocked at 20 MHz and provided in a 64-pin TQFP package. This device has 128 KBytes of flash and 8 KBytes RAM. In addition to various 16-bit and 32-bit timers and 10-bit AD converters, this device also features serial interfaces such as UART, SPI and I2C as well as a USB function interface.

Moreover, all ARM Cortex-M0 based 32-bit MCUs from Samsung Semiconductor include a single wire debug interface and are supported by currently available ARM Cortex-Mx compilers. For more information about the new MCUs as well as starter kits and on-chip debug emulators, please send an email to Samsung-Micros@msc-ge.com.

RL78/G14 MCUs With Enhanced Real-time Control Functions

Three timer modules and an event link controller ensure a high level of system performance:

Stutensee (Germany) — MSC offers the RL78/G14 Group of microcontrollers (MCUs) from Renesas Electronics. The new 16-bit MCUs with enhanced real-time control functions incorporate proven on-chip peripheral functions of Renesas’ R8C MCU family and feature a current consumption of only 70 µA/MHz at 32 MHz.

Among other things, the new MCUs — which MSC will present at embedded world 2012, Nuremberg in Hall 2, Booth 2-219 from February 28 to March 1, 2012 — are equipped with three proven timer modules, which are compatible with timers that already exist in the R8C MCU family. Timer RD comprises two universal 16-bit timers capable of operating at up to 64 MHz, which thanks to their three-phase complementary pulse width modulation (PWM) function are ideal for motor control applications. Timer RG is additionally equipped with an encoder input with which direction of rotation and rotation speed can be measured. Timer RJ is also a 16-bit timer module than can generate pulses or measure pulse widths.

The RL78/G14 MCU devices integrate a data transfer controller (DTC) and event link controller (ELC), which significantly reduce the CPU load and lower current consumption. The DTC enables memory-to-memory data transfers without using the CPU. Compared to the DMA function of the RL78/G13 device, the DTC supports a larger number of transfer channels and activation sources. Furthermore, it also enables data transfers from the flash memory. The event link controller (ELC) allows direct connection between individual peripheral functions bypassing the CPU and interrupt controller. It is also possible to use the ELC to start peripheral functions when the CPU is stopped, thereby reducing current consumption of the new 16-bit MCUs even further.

In addition, among the technical features of the RL78/G14 MCUs are an 8-bit D/A converter (DAC) with two channels and two analog comparators with window function, which is already well-known from the R8C family of MCUs. The DAC can, among other things, be utilized to implement an audio playback function or to generate high-resolution voltage signals.

Through additional multiply, divide, and multiply and accumulate CPU instructions, the need to handle overflow interrupts when performing arithmetic operations is eliminated with the RL78/G14 MCUs. Furthermore, the on-chip debugging functions of the new MCUs now also support trace data for up to 256 branches, enabling more efficient system development and evaluation.

The new MCUs are available in flash ROM capacities ranging from 16 KB to 256 KB, RAM capacities from 2.5 KB to 24 KB and a total of 17 package configurations, including Quad Flat Package (QFP), compact Quad Flat Non-Leaded (QFN) package and Land Grid Array (LGA) package, with pin counts from 30 to 100 pins.

Development tools for the RL78/G14 Group include the IAR Embedded Workbench, Renesas’ E1 integrated on-chip debugging emulator and IECUBE full-function in-circuit emulator. Renesas also plans to release a Flash Programmer and Renesas Starter Kit (RSK) supporting these new MCUs.

Detailed information about the RL78/G14 MCUs can be requested by sending an email to micros-renesas@msc-ge.com.

SmartFusion system on-chip offers full customization

The SmartFusion® customizable systemon- chip (cSoC) is the only device that integrates an FPGA, ARM® Cortex™-M3, and programmable analog, offering full customization, IP protection, and easeof- use. Based on a proprietary flash process, SmartFusion® cSoCs are ideal for hardware and embedded designers who need a true System on Chip (SoC) solution that gives more flexibility than traditional fixed-function microcontrollers without the excessive cost of soft processor cores on traditional FPGAs. SmartFusion® customizable System on Chip (cSoC) is an optimal solution for system management, mixed signal power management, motor control, industrial automation and many more. n Full Design Customizability n Intellectual Property (IP) Protection n Ease-of-Use Increases Productivity

ARM®

Because an ARM® processor was chosen for SmartFusion devices, Microsemi‘s customers can benefit from the extensive ARM® ecosystem. By building on Microsemi supplied hardware abstraction layer (HAL) and drivers, third party vendors can easily port RTOS and middleware for the SmartFusion devices.

Design Software

Libero® System on Chip (SoC) and Libero Integrated Design Environment (IDE) Microsemi are comprehensive software toolset for designing with Microsemi FPGAs, including Microsemi‘s new SmartFusion® family, the world‘s only customizable SoC with hard-wired ARM® Cortex™-M3 and programmable analog. Libero IDE will continue to be available for customers designing antifuse and older flash devices. Going forward, Microsemi will update Libero IDE as needed in order to support these products. Libero IDE v9.1 SP4 is the most recent release. The next major release will be Libero IDE v9.2 during 2012. Libero SoC v10.0 supporting ProASIC®3, IGLOO®, Fusion® and SmartFusion® device families and future silicon products. Libero SoC introduces a redesigned user interface, specifically targeted to simplify the design of Microsemi’s newest flash FPGAs. Standalone tools such as Silicon Sculptor, FlashPro and Synphony Model Compiler AE are not changing and will continue to include support for all silicon devices. Current licenses are valid for both software releases, a new license is not required for Libero® SoC.

e2v First to Introduce 12bit 1.5 GSPS Analogue to Digital Converter

Includes both direct RF sampling in L-band and low input voltage range

Building on the performance of its true single core high bandwidth family of ADCs with direct RF sampling, e2v announces the launch of EV12AS200, a 12-bit 1.5 GSPS analogue to digital converter (Distributor: MSC Vertriebs GmbH). The new ADC combines the benefits of direct RF sampling up to L band, calibration free stable performance versus temperature and a wider choice of ADC input driving options, thanks to the lowest input voltage range on the market for 12bit GSPS ADCs. 

This device enables further innovation in high verticality oscilloscopes, spectrum analysers, high dynamic range point-to-point microwave data links, electronic warfare systems and data acquisition COTS boards.

The EV12AS200 features a full power input bandwidth of 2.3GHz with a roll-off pattern optimised for operation in the L-band area. It also features the lowest input voltage range in the 12bit GSPS class with only 500mVp-p, without sacrificing performance in direct RF sampling. This delivers a significant reduction in distortion effects induced by high voltage swings at high frequencies in any amplifiers used prior to the ADC, such as variable gain amplifiers used for signal zooming purposes.

The low input voltage range of EV12AS200 is also a very convenient feature to build high verticality oscilloscopes with multiple amplification stages prior to the ADC while maintaining a very low level of distortion in the amplifiers.

EV12AS200 is also the only 12bit ADC operating at up to 1.5 GSPS without the use of any form of internal interleaving. This is key for the EV12AS200 to achieve both a calibration-free stable dynamic performance versus temperature, and nominal dynamic performance that is available immediately at power-up as soon as the supply voltage has stabilised, without the need to wait for multi-second silicon warm-up and calibration.

Other noticeable benefits of EV12AS200 include a low latency of fewer than 5 clock cycles, which is convenient for real time systems, guaranteed no-missing codes at 1.5GSPS, important for high verticality oscilloscopes, an analogue and clock input impedance of 100 Ohms that is stable versus frequency and temperature, and fine adjustments of input gain and offset as well as clock skew, which facilitates interleaving of multiple converters to achieve even higher sample rates.

EV12AS200 is offered in a small footprint FpBGA 196 package with the choice of commercial temperature grade (0°C to +90°C) or industrial temperature grade (-40°C to +110°C).

Datasheet, samples and quotations are now available.

For further information please contact MSC Vertriebs GmbH. 

Contact: e2v@msc-ge.com

Highly Integrated UMTS/HSPA Module With 7.2 Mbps Download Speed And 5.76 Mbps Upload Speed

Ideally suited for multimedia applications:

Stutensee (Germany), February 16, 2012 — MSC presents the U10 Multi-band WCDMA / GSM module from Quectel at embedded world 2012, Nuremberg in Hall 2, Booth 2-219 from February 28 to March 1, 2012. The U10 features a High Speed Downlink Packet Access (HSDPA) of 7.2 Mbps and a High Speed Uplink Packet Access (HSUPA) of 5.76 Mbps.

The module, which was designed for use in HSPA, GPRS and EDGE modems and portable multimedia applications, has dimensions of only 37.7 mm x 29.9 mm x 5 mm and is based on the new MT6276 communications controller that is equipped with a 32-bit ARM1176 RISC processor.

Apart from a high-speed USB 2.0 interface and two analog audio inputs/outputs, for multimedia applications the U10 module additionally provides three UARTs, separate interfaces for SD and Dual SIM cards as well as an own interface for cameras with up to 8 megapixels resolution. Furthermore, a digital signal processor with MPEG-4, H.263 and H.264 codecs, which is integrated on the MT6276 communications controller, enables the recording and playing back of high-resolution images and videos in real-time.

A Bluetooth Host Controller that is fully compatible with the Bluetooth Specification Version 2.1 + EDR is also integrated on the module and enables data transfer rates of up to 3 Mbit/s. Furthermore, cost-effective and simple host-based GPS modules can also be controlled with the U10 via a serial connection.

Thanks to a wide operating temperature range from -40°C to +85°C, the module is suited for many applications such as security, video surveillance, vehicle tracking systems, wireless POS, connected navigation systems and internet gateways. In addition to OpenCPU, the U10 also supports a wide variety of high-performance Internet Service Protocols such as TCP/IP, PPP, UDP, FTP, HTP and MMS. The current consumption in WCDMA and GSM idle mode is approximately 2 mA.

MSC offers a complete U10 development kit for evaluation purposes. The kit includes hardware and software, debug and test tools, approvals, application notes and test reports. Detailed information about the U10 UMTS/HSPA module is available from MSC and can be requested by sending an email to rf-quectel@msc-ge.com.

Hitachi´s Ruggedized, High Performance TFT Displays Suitable For Challenging Applications

Robust design for use under extreme environmental conditions

Stutensee (Germany) – Hitachi has announced the introduction of a new line-up of Rugged+ TFT LCD display modules specifically intended for use in extreme environment applications. These robust displays have been designed and developed to operate in demanding industrial and harsh environmental conditions. Hitachi's Rugged+ TFT displays are designed for high reliability medical, marine, aerospace, automotive and industrial applications. Some of the new modules feature Hitachi's IPS-Pro TFT technology which provides outstanding image quality when viewed at any viewing angle. IPS-Pro also provides exceptional color saturation, color stability, contrast and black levels with a 175° wide vertical and horizontal viewing angle. .

The new Rugged+ TFT product line-up currently includes the following display modules:

• a 9 cm (3,5") QVGA TX09D04VM3CAA
• a 13 cm (5.0”) VGA TX13D04VM2CAA
• a 15 cm (5,8") WQVGA TX15D02VM0CAA,
• three 18 cm (7") WVGA modules
• TX18D35VM0AAA (CMOS interface)
• TX18D35VM0AAB ( CMOS, high bright)
• TX18D37V0AAA (LVDS interface)
• a 20 cm (8") WVGA TX20D26VM0AAA

The entire range of Rugged+ displays feature industrial environment operating specifications with high brightness, long-life LED backlights with a lifespan up to 70.000 hours and will provide dependable operation between -30°C and +80°C.

The full line-up of Hitachi Rugged+ TFT display modules is available immediately at MSC Vertriebs GmbH.

Contact: hitachi@msc-ge.com

Gleichmann Electronics Expands its Range of Industrial Displays With PCT Based Multi-Touch Solutions From TRS-Star

Everything from one source – from the touch foil to the complete system

Stutensee (Germany) – Gleichmann Electronics now also offers multi-touch solutions — based on the tried-and-tested Atmel maXTouch technology — from TRS-Star. These multi-touch solutions have been designed to address the increasing demand for intuitive user interfaces for various industrial, household, healthcare, automobile and gaming machine applications.

The products currently offered by TRS-Star are single-chip based multi-touch solutions for diagonal screen sizes up to 12.1 inch (30.7 cm) and four-chip solutions for diagonal screen sizes from 10.4 inch (26.4 cm) to 22 inch (55.9 cm). Not only is the touch controller but the film is also developed by TRS-Star itself.

The necessary firmware adaptations po the tjuch conuroller and the integration of the multi-touch system into the particular customer applications are jointly carried out by Gleichmann Electronics and TRS-Star.

Detailed information about the multi-touch solutions from TRS-Star can be requested by sending an email to sros@msc-ge.com.

Electronic paper modules with switchable color options simplify the recognition of important information

Pervasive Displays breaks new ground with Beacon™ color options:

Stutensee (Germany) – Pervasive Displays, Inc. (PDI), a leading supplier of commercial and industrial EPDs (EPD stands for "Electrophoretic Display"), which are distributed by Gleichmann Electronics, offers the addition of area color and monocolor to its e paper modules and ECO-Sign solutions in order to emphasize important information.

The innovative Beacon™ technology, which was developed by PDI, enables assigning multiple colors to a particular area on the module and the information displayed in this area to be displayed in different colors according to the respective status. The information within the color areas can be turned on and off on demand.

In addition to the basic colors black and white, the monocolor option enables adding any third color to an e-paper module. The color location can change to emphasize different information and draw attention to important updates and exceptions.

Unlike traditional paper, e-paper modules with Beacon color enhancements can dynamically and instantly turn information on and off, as needed, allowing for a multitude of updates anytime. Typical applications include picking systems (parts, article numbers or special instructions can be recognized quickly thanks to the use of color), Kanban cards, automatic conveyer systems or also in retail stores, where special offers, advertised promotions and brand names can be significantly better distinguished from the other signage/information.

As with all e-paper modules and ECO-Sign solutions from PDI, models that use the new Beacon™ color options feature ultra-low power consumption, very good readability even in direct sunlight, wide vertical and horizontal viewing angles of almost 180° and high resolution of up to 160 dots per inch.

The area color option is already available and, according to Pervasive Displays, Inc. (PDI), the monocolor option will be available from next year. For more information please send an email to tmin@msc-ge.com.

MSC introduces Qseven™ Module with AMD® Embedded G-Series Processors

New Embedded Module features low Power Consumption, high Computing Performance and excellent Graphics

Stutensee, Germany – MSC Vertriebs GmbH presents its latest Qseven™ module based on the AMD^® Embedded G-Series of Accelerated Processing Units (APUs).  The compact module complies with the latest Qseven specification rev. 1.2 and measures 70 x 70mm.

Fanless system designs and highly integrated solutions

The AMD Embedded G-Series of APUs combines a low-power CPU and a discrete-level GPU in a single processor chip. MSC is focusing on the two lowest-power processors of this family for the new Qseven module: the T40E dual-core processor and the T40R single-core chip both clocked at 1.0 GHz and featuring very low power dissipation (TDP) of 6.4W or 5.5W, respectively. This allows fanless system designs and highly integrated solutions. Both processors come with the built-in AMD Radeon™ HD6250 Graphics Processing Unit (GPU) which delivers very high graphics performance and supports OpenGL^® 4.0, DirectX™-11 and OpenCL™ 1.1.

Each G-Series processor supports single or dual independent high-resolution displays and delivers exceptional multi-media capability up to Full-HD with hardware decode support for H.264, VC-1, MPEG2, WMV, DivX™ and Adobe^® Flash built into the Unified Video Decoder (UVD3). Paired with the AMD Embedded A50M Controller Hub, the platform supports advanced interfaces such as 6Gbit/s SATA, Gen. 2 PCI-Express and HD Audio which ideally suit the interface definition of the Qseven bus connector.

The Computer-On-Module MSC Q7-A50M offers four PCI Express™ x1 lanes, two high-speed SATA-II interfaces, eight USB 2.0 host ports, LPC, High-Definition Audio (HDA) and one GBit Ethernet interface.  An optional SATA-connected Flash Disk up to 32GB usable as system boot device may be soldered on the board.

The standard display interface conforms to the DVIHDMI 1.3 graphics standard or alternatively to DiaplayPort 1.1a and supports a maximum resolution of 1920 x 1200 pixels at 60Hz frame rate. A variety of different displays can be connected via LVDS (18/24 bit) with a maximum resolution of 1920x1200 pixels as the 2^nd display interface on Qseven. Both display interfaces can be used in clone or independent mode.

Suited for a wide range of embedded applications

With its rich interface and feature set, the MSC Q7-A50 module is suited for a wide range of embedded applications such as digital signage, industrial control, POS/POI and medical systems. Furthermore, its additional number-crunching capabilities based on APP (Accelerated Parallel Processing), GPGPU (General Purpose computation on Graphics Processing Units) and OpenCL™ enable it to solve challenging tasks like pattern matching and image recognition very economically.

The MSC Qseven platform integrates innovative hardware and AMI’s Aptio BIOS based security functions compliant with the requirements of the Trusted Computing Group (TCG). Due to the AMD G-Series’ low thermal design power (TDP) and the integrated ACPI 3.0 power management functions, the MSC Q7-A50M platform is also highly suitable for mobile applications.

Cost and power-efficient COM Express Modules with Celeron Processors

Stutensee, Germany – The MSC Vertriebs GmbH has expanded its powerful MSC CXB-6S COM Express ™ module family based on second generation Intel^® Core™ processors with two cost-efficient Intel^® Celeron^® CPU variants. The new boards almost reach the pricing level of Intel^® Atom™ and ARM^® based solutions.

The new embedded modules integrate the Intel^® HM65 PCH chipset and the Intel^®  Celeron^® processor 827E with one core (1.4GHz) or the dual-core Intel^®  Celeron^® processor 847E with 1.1GHz clock frequency. Both processors are manufactured in a 32 nm technology and use a 2 MB L3 cache. The specified thermal dissipation power (TDP) of both processors is 17W. The typical power consumption of the 827E based module is below 20W. More power-efficient is the shortly available COM Express ™ module with  Intel^®  Celeron^® processor 807E which consumes 10W (TDP) only.

The onboard Intel^® HD Graphics 2000 graphics controller supports DirectX 10.1 and OpenGL 3.0. The L3 cache shared by the processor cores and the graphics controller increases the performance significantly compared to the predecessor generation. Fast dual-channel DDR3 SDRAM modules (two SO-DIMM sockets) with a maximum capacity of 16 GB ensure high computing power and at the same time low power consumption.

Like all modern MSC COM Express ™ platforms, the MSC CXB-6S high-end modules are equipped with innovative hardware based security functionality compliant to the requirements of the Trusted Computing Group (TCG).

The MSC CXB-6S COM Express ™ module family in the basic form factor of 125 x 95mm offers six PCI Express™ x1 channels, an PCI Express™ Graphics (PEG) x16 interface, the classical 32 Bit PCI bus, eight USB 2.0 ports, HD audio and Gbit-Ethernet. Data can be stored via four SATA II channels with up to 300 MB/s, an enhanced IDE port or on an optionally populated 8 GB NAND flash SSD. For the connection of high resolution displays LVDS and VGA interfaces are available. Besides these there are DisplayPort and HDMI interfaces with a resolution of up to 2560 x 1600 pixels which are multiplexed on the PEG lanes.

The powerful platform runs under the operating systems Windows^® 7, Windows^® XP (embedded) and Linux. The AMI UEFI firmware has been implemented on the modules. For evaluation and design-in MSC supplies universal baseboards. Furthermore MSC offers the design service for application-specific motherboards.

MSC presents further ARM based Qseven Module Family

Stutensee, Germany – With the compact MSC Q7-TI8168 module the MSC Vertriebs GmbH expands its offering of ARM® based embedded boards in compliance with the Qseven ™ standard 1.20. The powerful platform integrates the Integra C6A8168 processor from Texas Instruments (TI) with an ARM® Cortex-A8 core with up to 3000 DMIPS and a digital signal processor (DSP). The 10 GMACS / 7,2 GFLPOS DSP @1.25 GHz C674x supports 32/64-bit single/double precision floating point. 

Designed for demanding image processing functions

The MSC Q7-TI8168 Qseven ™ module is special designed for demanding image processing functions e.g. in industrial automation, medicine, transportation and security systems. Wolfgang Eisenbarth, VP Marketing Embedded Computer Technology, MSC Vertriebs GmbH, said: „The DPS takes over the computing intensive image processing in real-time and unloads the ARM processor. Furthermore there is no need for the development of a specific software and its adaptation to the CPU core.”

The integrated ARM® Grafic Engine Neon supports video imaging, speech, audio codes and frameworks. TI offers with the optimized C6EZAccel and C6EZRun libraries a comprehensive software support for  numerous tasks e.g. digital filtering, complex mathematics calculations, image data processing and image analysis. C6EZRun executes the code porting, to run ARM® code on the DSP. The C6EZAccel tool accelerates the signal processing tasks via extensive DSP optimized algorithms (APIs).
The MSC Q7-TI8168 embedded module offers one PCI Express™ channel, a Gbit Ethernet interface, single channel LVDS up to 1920 x 1080 pixels and an HDMI/DVI 1.3 interface. There are five USB 2.0 hosts and an USB 2.0 client, an I2C, an AC97 audio and an SPI interface available. User data can be stored over two SATA II channels. A memory card will be connected via SD/SDIO. The Qseven ™ module integrates a 1 GB fast DDR3-1600 RAM and an NAND flash memory with a maximal capacity of 8 GB.

ARM® based MSC Q7-TI8168 Qseven ™ module

For fast development of embedded systems with the ARM® based MSC Q7-TI8168 Qseven ™ module MSC offers the MSC Q7-MB-EP4 baseboard. The compact Qseven ™ module is mounted via a proven MXM connection to the 148 x 102 mm compact baseboard, making it easy to thermally connect the Qseven ™ heat spreader to a metal enclosure and provide fanless heat dissipation.

Months ago, MSC Vertriebs GmbH has presented its first ARM® based Qseven ™ embedded platform MSC Q7-NT2 integrating the NVIDIA Tegra™ 290 low-power processor with dual-core ARM® Cortex A9.